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  • Dramatically improved probing accuracy achieved testing high density fine pitch boards that were not testable with the standard model. E4H6151 corresponds to testing standard sized board with up to min. pad size of 20µm and min. pad pitch of 50µm. Whereas E4H3325 is specifically designed for testing high density general module and mother boards with up to min. pad size of 15µm and min. pad pitch of 45µm.
  • Worldwide bestselling budget model offers high-speed testing with simplified clamp system
  • Standard Model in EMMA Series with test speed of 6,500 Points/Min. Corresponds to testing various types of boards, from large size to high density and FPC boards.
  • Model best suitable for testing larger size boards (burn-in and backplane boards). Despite its greater size, high speed testing is still secured with higher alignment accuracy.
  • Extreme high accuracy testing was achieved by Type9 usage. E4S6151 corresponds to testing standard sized board with up to min. pad size of 15µm and min. pad pitch of 45µm. Whereas E4S3325 is specifically designed for testing package boards like general CSP and Flip-Chip with up to min. pad size of 10µm and min. pad pitch of 40µm.
  • Developed to test larger size boards (burn-in, backplane, and back boards). One of the significant advantages comes from implementing Dual-Servo Drive for movement along horizontal axis. This has achieved conducting high speed testing in this extra-large size without limitation.
  • High accuracy model from F2 Series. F2H6151 corresponds to testing standard sized board with up to min. pad size of 20µm and min. pad pitch of 50µm. Whereas F2H3325 is specifically designed for testing general module board and high density mother board with up to min. pad size of 15µm and min. pad pitch of 45µm.
  • F2M9172 Larger Size Model corresponds to larger board, touch panel, and glass boards. F2M9172SH/SH2 Larger Size Model connected to the shuttle table achieved dramatic increase in throughput production. SH stands for single shuttle (shuttle x1) and SH2 stands for dual shuttle (shuttle x2)
  • Extreme High Accuracy Testing is made possible through the use of Type9 Probe.F2S6151 corresponds to testing standard sized board with up to min. pad size of 15µm and min. pad pitch of 45µm. Whereas F2S3325 is specifically designed for testing general package boards such as CSP and Flip Chip up to min. pad size of 10µm and min. pad pitch of 40µm.
  • 4 Probe Tester Standard Model / 4 Probe Tester Low Budget

    High Speed Prober from the new EMMA generation developed for testing denser and complex PCB with high-speed and high-accuracy. A low budget model with a high-speed and high-accuracy test. Also upgraded electronics, onboard touch screen for easy use, type 7 probes and manual clamping system.

  • 8 Probe High-Speed Tester

    High Speed 8 Prober System with a realised incredible Speed of over 9000 test points/Min.

  • E4M6151
    • Test area up to 610 x 510 mm
    • Board size from 60 x 100 mm up to 635 x 535 mm
    • 4 Probes (2 front/2 backside)
    • Repeatable accuracy ± 4 µm (S-Serie ±2 µm)
    • Resolution 2 µm (S-Series 1 µm)
  • E4M6151AL Fully automatic 4 Probe Tester High-Speed Flying Probe Tester with Loader and Unloader (OK/NG) for the production of extremely high volumes.
    • Test area up to 610 x 510 mm
    • Board size from 60 x 100 mm up to 635 x 535 mm
    • 4 Probes (2 front/2 backside)
    • Repeatable accuracy ± 4 µm (2 µm)
    • Resolution 2 µm (1 µm)
    • High throughput up to 10.000 points/min (E8) especially for HD and ML-Boards (E4: up to 6.600 points/min)
    • Various options available, e.g. OK/NG stamper function, Barcode Reader, Virtual Command Center, HVS, HiPot, EVS, FVS
  • E8M6151 Electric 8 Probe Tester High-Speed Flying Probe Tester for the production of extremely high volumes. Optional with Loader and Unloader: model no. E8M6151AL. Revolutionizing the E8-Series. Exponential High-Speed Testing with 10,000 Test-Points/min. Four probes mounted on each side of the tester move freely to record an exponentially high testing speed. Over 10,000 Test-Points/min. are accomplished by a combination of increased probe efficiency and refined software control. While maintaining the fastest possible testing speed the resolution of 2μm and repeatable accuracy of ±4μm is possible.
    • Test area up to 610 x 510 mm
    • Board size from 60 x 75 mm up to 635 x 535 mm
    • 8 Probes (4 front/ 4 backside)
    • Repeatable accuracy ± 4 µm
    • Resolution 2 µm
    • High throughput up to 10,000 points/min (E8) especially for HD and ML-Boards
    • Various options available, e.g. OK/NG stamper function, Barcode Reader, Virtual Command Center, HVS, HiPot, EVS, FVS
  • 8 Probe System with Full Automation. Standard Model (610 x 510 mm) and Large Size Model (810 x 610 mm) are available. The newly developed auto loader/unloader attached to the side allows for 24/7 unattended testing. Once the boards are stacked on the loader, suction pads automatically convey the boards to the testing area. Upon completion of the test the boards are speedily transferred to the unloader, separated by PASS and FAIL boards. The new AL2 Model is capable of transferring two boards (size under 250 x 250mm) simultaneously to dramatically improve the throughput for smaller sized boards.
  • STAR REC M6II SW is an open/leak test system that is designed for a wide size HDI motherboard, loaded on tablet devices etc.
    • Users can select the most suitable Loader & Unloader depending on the test object. (In common with M6ⅡWide)
    • A high-speed step & repeat mechanism is applicable for the multifaceted substrate by the use of a rotary table mechanism. (In common with M6ⅡWide)
    • Maximum work size - W300 x D250mm

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