• Dramatically improved probing accuracy achieved testing high density fine pitch boards that were not testable with the standard model. E4H6151 corresponds to testing standard sized board with up to min. pad size of 20µm and min. pad pitch of 50µm. Whereas E4H3325 is specifically designed for testing high density general module and mother boards with up to min. pad size of 15µm and min. pad pitch of 45µm.
  • Worldwide bestselling budget model offers high-speed testing with simplified clamp system
  • Standard Model in EMMA Series with test speed of 6,500 Points/Min. Corresponds to testing various types of boards, from large size to high density and FPC boards.
  • EMMA with vertical type full automation. With newly developed auto loader/unloader on the side 24 hours unattended testing is now possible. Once the boards are stacked on the loader, suction pads automatically conveys the boards to the test area. Once the test is complete, boards are speedily transferred to unloader, separate to PASS and FAIL boards.
  • Model best suitable for testing larger size boards (burn-in and backplane boards). Despite its greater size, high speed testing is still secured with higher alignment accuracy.
  • Extreme high accuracy testing was achieved by Type9 usage. E4S6151 corresponds to testing standard sized board with up to min. pad size of 15µm and min. pad pitch of 45µm. Whereas E4S3325 is specifically designed for testing package boards like general CSP and Flip-Chip with up to min. pad size of 10µm and min. pad pitch of 40µm.
  • Four probes mounted on the each side of the tester moves freely to record exponentially high test speed. Over 10,000 Test-Points/min. was accomplished by the combination of increasing probe efficiency and polished software control. While maintaining the fastest test speed, resolution of 2µm and repeatable accuracy of ±4µm is capable.
  • EMMA with vertical type full automation. With newly developed auto loader/unloader on the side 24 hours unattended testing is now possible. Once the boards are stacked on the loader, suction pads automatically conveys the boards to the test area. Once the test is complete, boards are speedily transferred to unloader, separate to PASS and FAIL boards.
  • Developed to test larger size boards (burn-in, backplane, and back boards). One of the significant advantages comes from implementing Dual-Servo Drive for movement along horizontal axis. This has achieved conducting high speed testing in this extra-large size without limitation.
  • High accuracy model from F2 Series. F2H6151 corresponds to testing standard sized board with up to min. pad size of 20µm and min. pad pitch of 50µm. Whereas F2H3325 is specifically designed for testing general module board and high density mother board with up to min. pad size of 15µm and min. pad pitch of 45µm.
  • F2M9172 Larger Size Model corresponds to larger board, touch panel, and glass boards. F2M9172SH/SH2 Larger Size Model connected to the shuttle table achieved dramatic increase in throughput production. SH stands for single shuttle (shuttle x1) and SH2 stands for dual shuttle (shuttle x2)
  • Extreme High Accuracy Testing is made possible through the use of Type9 Probe.F2S6151 corresponds to testing standard sized board with up to min. pad size of 15µm and min. pad pitch of 45µm. Whereas F2S3325 is specifically designed for testing general package boards such as CSP and Flip Chip up to min. pad size of 10µm and min. pad pitch of 40µm.

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