Extreme High Accuracy Testing is made possible through the use of Type9 Probe.F2S6151 corresponds to testing standard sized board with up to min. pad size of 15µm and min. pad pitch of 45µm. Whereas F2S3325 is specifically designed for testing general package boards such as CSP and Flip Chip up to min. pad size of 10µm and min. pad pitch of 40µm.